? semiconductor components industries, llc, 2006 june, 2006 ? rev. 3 1 publication order number: 74ALVCH16374/d 74ALVCH16374 low?voltage 16?bit d?type flip?flop with bus hold 1.8/2.5/3.3 v (3 ? state, non ? inverting) the 74ALVCH16374 is an advanced performance, non ? inverting 16 ? bit d ? type flip ? flop. it is designed for very high ? speed, very low ? power operation in 1.8 v, 2.5 v or 3.3 v systems. the vcxh16374 is byte controlled, with each byte functioning identically, but independently. each byte has separate output enable and clock pulse inputs. these control pins can be tied together for full 16 ? bit operation. the 74ALVCH16374 consists of 16 edge ? triggered flip ? flops with individual d ? type inputs and 3.6 v ? tolerant 3 ? state outputs. the clocks (cpn) and output enables (oen ) are common to all flip ? flops within the respective byte. the flip ? flops will store the state of individual d inputs that meet the setup and hold time requirements on the low ? to ? high clock (cp) transition. with the oe low, the contents of the flip ? flops are available at the outputs. when the oe is high, the outputs go to the high impedance state. the oe input level does not affect the operation of the flip ? flops. the data inputs include active bushold circuitry, eliminating the need for external pull ? up resistors to hold unused or floating inputs at a valid logic state. ? designed for low voltage operation: v cc = 1.65 ? 3.6 v ? 3.6 v tolerant inputs and outputs ? high speed operation: 3.6 ns max for 3.0 to 3.6 v 4.5 ns max for 2.3 to 2.7 v 7.8 ns max for 1.65 to 1.95 v ? static drive: 24 ma drive at 3.0 v 12 ma drive at 2.3 v 4 ma drive at 1.65 v ? supports live insertion and withdrawal ? includes active bushold to hold unused or floating inputs at a valid logic state ? i off specification guarantees high impedance when v cc = 0 v ? ? near zero static supply current in all three logic states (40 a) substantially reduces system power requirements ? latchup performance exceeds 250 ma @ 125 c ? esd performance: human body m odel >2000v; machine model >200v ? second source to industry standard 74ALVCH16374 ?to ensure the outputs activate in the 3 ? state condition, the output enable pins should be connected to v cc through a pull ? up resistor. the value of the resistor is determined by the current sinking capability of the output connected to the oe pin. http://onsemi.com marking diagram a = assembly location wl = wafer lot yy = year ww = work week tssop ? 48 dt suffix case 1201 1 48 74ALVCH16374dt awlyyww 1 48 device package shipping ordering information 74ALVCH16374dtr tssop 2500 / reel pin names function output enable inputs clock pulse inputs inputs outputs pins oen cpn d0 ? d15 o0 ? o15
74ALVCH16374 http://onsemi.com 2 figure 1. 48 ? lead pinout (top view) figure 2. logic diagram 48 1 cp1 oe1 47 2 d0 o0 46 3 d1 o1 45 4 gnd gnd 44 5 d2 o2 43 6 d3 o3 42 7 v cc v cc 41 8 d4 o4 40 9 d5 o5 39 10 gnd gnd 38 11 d6 o6 37 12 d7 o7 36 13 d8 o8 35 14 d9 o9 34 15 gnd gnd 33 16 d10 o10 32 17 d11 o11 31 18 v cc v cc 30 19 d12 o12 29 20 d13 o13 28 21 gnd gnd 27 22 d14 o14 26 23 d15 o15 25 24 cp2 oe2 o0 d0 o1 d1 o2 d2 o3 d3 o4 d4 o5 d5 o6 d6 o7 d7 ncp q d ncp q d ncp q d ncp q d ncp q d ncp q d ncp q d ncp q d cp1 oe1 o8 d8 o9 d9 o10 d10 o11 d11 o12 d12 o13 d13 o14 d14 o15 d15 ncp q d ncp q d ncp q d ncp q d ncp q d ncp q d ncp q d ncp q d cp2 oe2 1 48 24 25 2 47 3 46 5 44 6 43 8 41 9 40 11 38 12 37 13 36 14 35 16 33 17 32 19 30 20 29 22 27 23 26 1 48 25 24 d0 47 d1 46 d2 44 d3 43 o0 2 en1 oe1 cp1 cp2 oe2 o1 3 o2 5 o3 6 en2 en3 en4 d4 41 d5 40 d6 38 d7 37 o4 8 o5 9 o6 11 o7 12 d8 36 d9 35 d10 33 d11 32 o8 13 o9 14 o10 16 o11 17 d12 30 d13 29 d14 27 d15 26 o12 19 o13 20 o14 22 o15 23 1 ? 2 ? 3 ? 4 ? 1 1 1 1 figure 3. iec logic diagram inputs outputs inputs outputs cp1 oe1 d0:7 o0:7 cp2 oe2 d8:15 o8:15 l h h l h h l l l l l l x l x o0 x l x o0 x h x z x h x z h = high voltage level; l = low voltage level; z = high impedance state; = low ? to ? high transition; x = high or low voltage level and transitions are acceptable, for i cc reasons, do not float inputs. o0 = no change.
74ALVCH16374 http://onsemi.com 3 maximum ratings (note 1) symbol parameter value unit v cc dc supply voltage 0.5 to 4.6 v v i dc input voltage 0.5 to 4.6 v v o dc output voltage 0.5 to 4.6 v i ik dc input diode current v i < gnd 50 ma i ok dc output diode current v o < gnd 50 ma i o dc output sink current 50 ma i cc dc supply current per supply pin 100 ma i gnd dc ground current per ground pin 100 ma t stg storage temperature range 65 to 150 c t l lead temperature, 1 mm from case for 10 seconds 260 c t j junction temperature under bias 150 c ja thermal resistance (note 2) 90 c/w msl moisture sensitivity level 1 f r flammability rating oxygen index: 30 to 35 ul 94 v ? o @ 0.125 in v esd esd withstand voltage human body model (note 3) machine model (note 4) charged device model (note 5) 2000 200 n/a v i latch ? up latch ? up performance above v cc and below gnd at 125 c (note 6) 250 ma stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. i o absolute maximum rating must be observed. 2. measured with minimum pad spacing on an fr4 board, using 10 mm ? by ? 1 inch, 2 ? ounce copper trace with no air flow. 3. tested to eia/jesd22 ? a114 ? a. 4. tested to eia/jesd22 ? a115 ? a. 5. tested to jesd22 ? c101 ? a. 6. tested to eia/jesd78. recommended operating conditions symbol parameter min max unit v cc supply voltage operating data retention only 2.3 1.5 3.6 3.6 v v i input voltage (note 7) ? 0.5 3.6 v v o output voltage (active state) (3 ? state) 0 0 3.6 3.6 v t a operating free ? air temperature 40 85 c t/ v input transition rise or fall rate v cc = 2.5 v 0.2 v v cc = 3.0 v 0.3 v 0 0 20 10 ns/v 7. unused inputs may not be left open. all inputs must be tied to a high ? logic voltage level or a low ? logic input voltage level.
74ALVCH16374 http://onsemi.com 4 dc electrical characteristics symbol parameter condition t a = 40 c to 85 c unit min max v ih high level input voltage (note 8) 1.65 v v cc 2.3 v 0.65 v cc v 2.3 v v cc 2.7 v 1.7 2.7 v v cc 3.6 v 2.0 v il low level input voltage (note 8) 1.65 v v cc 2.3 v 0.35 v cc v 2.3 v v cc 2.7 v 0.7 2.7 v v cc 3.6 v 0.8 v oh high level output voltage 1.65 v v cc 3.6 v; i oh = 100 a v cc 0.2 v v cc = 1.65 v; i oh = 4 ma 1.2 v cc = 2.3 v; i oh = 6 ma 2.0 v cc = 2.3 v; i oh = 12 ma 1.7 v cc = 2.7 v; i oh = 12 ma 2.2 v cc = 3.0 v; i oh = 12 ma 2.4 v cc = 3.0 v; i oh = 24 ma 2.0 v ol low level output voltage 1.65 v v cc 3.6 v; i ol = 100 a 0.2 v v cc = 1.65 v; i ol = 4 ma 0.45 v cc = 2.3 v; i ol = 6 ma 0.4 v cc = 2.3 v; i ol = 12 ma 0.7 v cc = 2.7 v; i ol = 12 ma 0.4 v cc = 3.0 v; i ol = 24 ma 0.55 i i input leakage current 1.65 v v cc 3.6 v; 0 v v i 3.6 v 5.0 a i i(hold) minimum bus ? hold input current v cc = 3.6 v; v in = 0 to 3.6 v 500 a v cc = 3.0 v, v in = 0.8 v 75 v cc = 3.0 v, v in = 2.0 v 75 v cc = 2.3 v, v in = 0.7 v 45 v cc = 2.3 v, v in = 1.7 v 45 v cc = 1.65 v, v in = 0.58 v 25 v cc = 1.65 v, v in = 1.07 v 25 i oz 3 ? state output current 1.65 v v cc 3.6 v; 0 v v o 3.6 v; v i = v ih or v il 10 a i off power ? off leakage current v cc = 0 v; v i or v o = 3.6 v 10 a i cc quiescent supply current (note 9) 1.65 v v cc 3.6 v; v i = gnd or v cc 40 a 1.65 v v cc 3.6 v; 3.6 v v i , v o 3.6 v 40 i cc increase in i cc per input 2.7 v v cc 3.6 v; v ih = v cc 0.6 v 750 a 8. these values of v i are used to test dc electrical characteristics only. 9. outputs disabled or 3 ? state only.
74ALVCH16374 http://onsemi.com 5 ac characteristics (note 10; t r = t f = 2.0 ns; c l = 30 pf; r l = 500 ) symbol parameter wave ? form limits unit t a = ? 40 c to +85 c v cc = 3.0 v to 3.6 v v cc = 2.3 v to 2.7 v v cc = 1.65 v to 1.95 v min max min max min max f max clock pulse frequency 1 250 200 100 mhz t plh t phl propagation delay cp to on 1 1.0 1.0 3.6 3.6 1.0 1.0 4.5 4.5 1.0 1.0 7.8 7.8 ns t pzh t pzl output enable time to high and low level 2 1.0 1.0 4.7 4.7 1.0 1.0 6.0 6.0 1.0 1.0 9.2 9.2 ns t phz t plz output disable time from high and low level 2 1.0 1.0 4.1 4.1 1.0 1.0 5.1 5.1 1.5 1.5 6.8 6.8 ns t s setup time, high or low dn to cp 3 1.5 0.5 2.5 ns t h hold time, high or low dn to cp 3 1.0 0.5 1.0 ns t w cp pulse width, high 3 1.5 0.5 4.0 ns t oshl t oslh output ? to ? output skew (note 11) 0.5 0.5 0.5 0.5 0.75 0.75 ns 10. for c l = 50 pf, add approximately 300 ps to the ac maximum specification. 11. skew is defined as the absolute value of the differ ence between the actual propagation delay for any two separate outputs of the same device. the specification applies to any outputs switching in the same direction, either high ? to ? low (t oshl ) or low ? to ? high (t oslh ); parameter guaranteed by design. capacitive characteristics symbol parameter condition typical unit c in input capacitance note 12 6 pf c out output capacitance note 12 7 pf c pd power dissipation capacitance note 12, 10 mhz 20 pf 12. v cc = 1.8, 2.5 or 3.3 v; v i = 0 v or v cc . waveform 1 ? propagation delays, setup and hold times t r = t f = 2.0 ns, 10% to 90%; f = 1 mhz; t w = 500 ns v ih 0 v dn cpn vm on v ih 0 v v oh v ol t plh , t phl t h t s vm vm f max waveform 2 ? output enable and disable times t r = t f = 2.0 ns, 10% to 90%; f = 1 mhz; t w = 500 ns v ih 0 v 0 v oen on t pzh v cc t phz t pzl t plz on vm vm vm v oh vy vx v ol vm figure 4. ac waveforms vm vm
74ALVCH16374 http://onsemi.com 6 waveform 3 ? pulse width t r = t f = 2.0 ns (or fast as required) from 10% to 90% v ih 0 v v ih 0 v vm vm t w vm vm t w cpn cpn figure 5. ac waveforms symbol v cc 3.3 v 0.3 v 2.5 v 0.2 v 1.8 v 0.15 v v ih 2.7 v v cc v cc v m 1.5 v v cc /2 v cc /2 v x v ol + 0.3 v v ol + 0.15 v v ol + 0.15 v v y v oh ? 0.3 v v oh ? 0.15 v v oh ? 0.15 v open pulse generator r t dut v cc r l r l c l 6 v or v cc 2 gnd test switch t plh , t phl open t pzl , t plz 6 v at v cc = 3.3 0.3 v; v cc 2 at v cc = 2.5 0.2v; 1.8 v 0.15 v t pzh , t phz gnd c l = 50 pf for v cc = 3.0 0.3 v r l = 500 or equivalent r t = z out of pulse generator (typically 50 ) figure 6. test circuit
74ALVCH16374 http://onsemi.com 7 figure 7. carrier tape specifications d 1 for components 10 pitches cumulative tolerance on tape 0.2 mm ( 0.008") 2.0 mm 1.2 mm and larger center lines of cavity embossment user direction of feed k 0 see note 2 p 0 p 2 d e f w b 0 + + + k t b 1 top cover tape p see note 2 a 0 for machine reference only including draft and radii concentric around b 0 r min. tape and components shall pass around radius r" without damage bending radius *top cover tape thickness (t 1 ) 0.10 mm (0.004") max. embossed carrier embossment typical component cavity center line typical component center line maximum component rotation 10 camber (top view) allowable camber to be 1 mm/100 mm nonaccumulative over 250 mm 100 mm (3.937") 1 mm (0.039") max 250 mm (9.843") 1 mm max tape embossed carrier dimensions (see notes 1 and 2) tape size b 1 max d d 1 e f k p p 0 p 2 r t w 24mm 20.1mm (0.791") 1.5 + 0.1mm ?0.0 (0.059 +0.004" ?0.0) 1.5mm min (0.060") 1.75 0.1 mm (0.069 0.004") 11.5 0.10 mm (0.453 0.004") 11.9 mm max (0.468") 16.0 0.1 mm (0.63 0.004") 4.0 0.1 mm (0.157 0.004") 2.0 0.1 mm (0.079 0.004") 30 mm (1.18") 0.6 mm (0.024") 24.3 mm (0.957") 13. metric dimensions govern ? english are in parentheses for reference only. 14. a 0 , b 0 , and k 0 are determined by component size. the clearance between the components and the cavity must be within 0.05 mm min to 0.50 mm max. the component cannot rotate more than 10 within the determined cavity.
74ALVCH16374 http://onsemi.com 8 figure 8. reel dimensions 13.0 mm 0.2 mm (0.512" 0.008") 1.5 mm min (0.06") 50 mm min (1.969") 20.2 mm min (0.795") full radius t max g a reel dimensions tape size a max g t max 24 mm 360 mm (14.173") 24.4 mm + 2.0 mm, ?0.0 (0.961" + 0.078", ?0.00) 30.4 mm (1.197") figure 9. reel winding direction direction of feed barcode label hole pocket
74ALVCH16374 http://onsemi.com 9 tape trailer (connected to reel hub) no components 160 mm min tape leader no components 400 mm min components direction of feed cavity tape top tape figure 10. tape ends for finished goods figure 11. reel configuration user direction of feed l figure 12. package footprint f k g
74ALVCH16374 http://onsemi.com 10 package dimensions tssop dt suffix case 1201 ? 01 issue a ??? ??? ??? s u m 0.12 (0.005) v s t s u m 0.254 (0.010) t ? v ? b a l k ? u ? 48x ref pin 1 ident. 124 25 48 0.076 (0.003) seating d ? t ? plane dim min max min max inches millimeters a 12.40 12.60 0.488 0.496 b 6.00 6.20 0.236 0.244 c ??? 1.10 ??? 0.043 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.50 bsc 0.0197 bsc h 0.37 ??? 0.015 ??? j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.17 0.27 0.007 0.011 k1 0.17 0.23 0.007 0.009 l 7.95 8.25 0.313 0.325 m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 5. terminal numbers are shown for reference only. 6. dimensions a and b are to be determined at datum plane ?w?. c g h ? w ? detail e j k1 k j1 section n ? n m 0.25 (0.010) f detail e n n on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 74ALVCH16374/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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